Bergquist Company GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.


  • Low-modulus polymer material
  • Available with fiberglass/rubber carriers or in a non-reinforced version
  • Special fillers achieve specific thermal and conformability characteristics
  • Highly conformable to uneven and rough surfaces reducing interfacial resistance
  • Electrically isolating
  • Natural tack on one or both sides with a protective liner
  • Variety of thicknesses and hardnesses
  • Range of thermal conductivity
  • Available in sheets and die-cut parts
  • Eliminates air gaps to reduce thermal resistance
  • Low-stress vibration dampening
  • Shock absorbing
  • Easy material handling
  • Simplified application
  • Puncture, shear, and tear-resistant
  • Improved performance for high-heat assemblies
  • Compatible with automated dispensing equipment


  • Between an IC and a heat sink or chassis (typical packages include BGAs, QFP, SMT power components, and magnetics)
  • Between a semiconductor and heat sink
  • CD-ROM/DVD cooling
  • Heat pipe assemblies
  • Memory modules
  • Hard drive cooling
  • Power supplies
  • IGBT modules
  • Signal amplifiers
  • Between other heat-generating devices and chassis

General Overview

Bergquist Company GAP PAD® Thermally Conductive Materials


Publicado: 2021-08-04 | Actualizado: 2024-06-03