Bergquist Company TGP HC5000 Highly Conformable GAP PAD®
Bergquist Company TGP HC5000 Highly Conformable GAP PAD® is a silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with a clear PET liner with reduced tack on one side and Blue Diamond liner. Bergquist Company TGP HC5000 Highly Conformable GAP PAD is easily reworkable.
Features
- 5.0 W/m-K high thermal conductivity
- Highly conformable - "S-Class" softness
- Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
- Natural inherent tack reduces interfacial thermal resistance
- Fiberglass reinforced for puncture, shear, and tear resistance
- Excellent thermal performance at low pressures
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Bergquist Company GAP PAD® Thermally Conductive Materials
Interface materials with greater conformability, higher thermal performance, and easier application.
Publicado: 2016-09-09
| Actualizado: 2022-11-15