Digi XBee® 3 Global LTE Cat 4 Dev Kit
Digi XBee® 3 Global LTE Cat 4 Development Kit provides OEMs with a simple, quick way to integrate higher-bandwidth cellular connectivity into their devices. This dev kit is designed to get started in the world of embedded cellular. The hardware and software engineers, corporate technologists, educators, and students can quickly learn more about cellular integration using the hands-on examples included in the kit. The XBee 3 Global LTE Cat 4 development kit includes an embedded modem and an XBee 3 development board. The kit additionally includes a SIM card (3 months of free cellular service) for LTE Cat 4 cellular service, antennas, and power cables. Typical applications include monitoring systems, digital signages, and smart agriculture.
Features
- Integrated MicroPython programmability enables custom scripting directly on the modem
- 2G and 3G fallback and GNSS for accurate location services
- Transparent and API modes simplify software design
- MQTT support for Microsoft Azure and Amazon AWS
- FCC-certified and end-device-certified with major carriers
- Direct USB for easy PPP integration option
- Integrated with Digi TrustFence® security framework
- Easy to manage with Digi XBee Studio® and Digi Remote Manager®
- BLUETOOTH® Low Energy for beaconing, connecting to Bluetooth sensors, and local configuration using the Digi XBee mobile app
- Includes SIM, ready to activate and begin using
Specifications
- Hardware:
- Thales PLS83-W cellular chipset
- Digi XBee 20-pin through-hole form factor (connector footprint)
- Antenna options:
- 2 U.FL: cellular diversity
- 1 U.FL: GNSS-embedded Bluetooth antenna
- 30.48mm x 43.18mm (1.2in x 1.7in) dimensions
- -40°C to +80°C operating temperature range
- 4FF Nano SIM size
- Cellular characteristics:
- Transmit power (4G LTE/3G/2G): 23dBm / 23.5dBm / 30dBm to 33dBm
- Receive sensitivity (4G LTE/3G/2G): 103dBm / 110dBm / 108dBm
- Supported bands:
- LTE: B1, B2, B3, B4, B5, B7, B8, B12, B13, B18, B19, B20, B26, B28, B38, B40, B41, and B66
- 3G: B1, B2, B3, B4, B5, B6, B8, and B19
- 2G: 850MHz, 900MHz, 1800MHz, and 1850MHz
- Downlink/uplink speeds:
- LTE: 150Mbps downlink and 50Mbps uplink
- 3G: 14.4Mbps downlink and 5.76Mbps uplink
- 2G: 237kbps downlink and uplink
- Full-duplex mode
- Interface and I/O:
- UART, SPI, and USB data interfaces
- Operating modes of transparent and API over serial and PPP over USB
- Digi TrustFence security with secure boot and protected JTAG
- Configuration tools: Digi XBee Studio (local) and Digi Remote Manager (OTA)
- Embedded programmability with MicroPython with 8MB flash/64kB RAM
- I/O: 4 ADC lines (10-bit), 13 digital I/O, and I²C
- Bluetooth Low Energy
- Power requirements (at 3.3VDC input power):
- Supply voltage of 2.8V to 5.5V
- Peak transmit current of 1050mA with Bluetooth disabled; 1090mA with Bluetooth enabled
- 890mA Average transmit current
- 320mA Average receive current
Kit Contents
- Digi XBee 3 Global LTE Cat 4 embedded modem
- Digi XBee 3 development board
- SIM card for LTE Cat 4 cellular service out of the box
- 3 months of free cellular service
- Free schematic review by Digi WDS
- Antennas and power cable
Videos
Associated Products
Digi XBee® 3 Global LTE Cat 4 Smart Modems
An easy way to integrate high-bandwidth cellular connectivity into OEM devices or IoT gateway.
Digi XBee® Multiprogrammer
A combination of hardware and software that allows for programming multiple Digi RF devices.
Related Kits
Digi XBee® XBIB-C Development Boards
Utilizes USB Direct Mode for use with XBee® 3 Cellular Modules.