Advanced Thermal Solutions maxiFLOW™ Heat Sinks
Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.
ATS maxiFLOW™ Heat Sinks are well suited to meet the thermal requirements of a broad range of electronics packages such as ball grid array (BGA), quad flat package (QFP), lead chip carrier (LCC), land grid array (LGA), ceramic leaded chip carrier (CLCC), thin small outline package (TSOP), dual inline package (DIP), and low-profile quad flat package (LQFP).
Features
- Fabricated from anodized extruded aluminum for maximum thermal performance
- Low-profile spread fin array
- High thermal performance through convection cooling
- Designed for standard height components from 3mm to 4.5mm
- Available with maxiGRIP heat sink attachment, thermal tape, or push pin attachments
Applications
- Low-profile component cooling
- Compatible with a broad range of electronic packages: BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, and LQFP
Videos
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