Zipper Fin Heat Sink Assemblies

Aavid Zipper Fin Heat Sink Assemblies are suitable for air-cooled solutions for high-powered forced convection applications for mass production. These heat sinks are optimized for Intel® Xenon® processor microarchitecture in an FCLGA3647 package. The zipper fin stack is constructed from a series of individual sheet metal fins that are folded, stamped, and zipped together without using interlocking features. The thin fin geometry lowers pressure drops, improves system airflow, and reduces fan costs. Because the zipper fins are joined together on both the top and bottom of the fins, these heat sink assemblies offer high mechanical stability. Aavid Zipper Fin Heat Sink Assemblies are ideal for higher volume, high-performance applications.

Resultados: 2
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (COP) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Producto Diseñado para Estilo de montaje Material de sumidero térmico Estilo de aleta Longitud Ancho Altura
Aavid Cuerpo de Refrigeración Heat Sink for Intel Xeon, 108x78x25.2mm, Copper Plate/Heat Pipe Spreader Type 36En existencias
Min.: 1
Mult.: 1

Heatpipe Assemblies Heat Sinks Panel Copper Zipper Fin 108 mm 78 mm 25.5 mm
Aavid Cuerpo de Refrigeración Heat Sink for Intel Xeon, 108x78x64mm, Copper Plate+Heat Pipe Spreader Type No en existencias

Heatpipe Assemblies Heat Sinks Panel Copper Zipper Fin 108 mm 78 mm 64 mm